这家设备公司完成数亿元战略融资

Group 1 - Zhuhai Silicon Cool Technology Co., Ltd. has completed a strategic financing round of several hundred million yuan, with participation from well-known investment institutions such as Anxin Investment, Chip Alliance Capital, Huatai Zijin, and others [1] - The funds will be primarily used for the mass delivery of silicon carbide (SiC) pre-sintering bonding equipment, commercialization of advanced packaging equipment (such as HBM), and expansion of high-end production capacity and global customer outreach [1] - Established in 2019, the company has a core team from leading global packaging equipment firms and has significant technical accumulation and industry experience in semiconductor packaging equipment [1] Group 2 - Silicon Cool Technology has become a leader in domestic replacement for IGBT/SiC power module mounting equipment, achieving major breakthroughs in optical communication and advanced packaging [3] - The company has successfully provided over a hundred sets of equipment to major automotive companies such as BYD, Li Auto, NIO, and Huawei, producing over 100,000 silicon carbide power semiconductor devices, with industry-leading mass production capabilities [3] - Annual revenue has tripled, and the company has obtained more than ten invention patents [3] Group 3 - Chip Alliance Capital, as one of the investors, recognizes the collaborative potential with Silicon Cool Technology, emphasizing the importance of their partnership in the IGBT/SiC power module mounting machine sector [2] - The collaboration aims to promote domestic substitution of key semiconductor packaging equipment and build a self-controlled industrial chain [2]