中科科化科创板IPO已问询 环氧塑封料业务规模在内资厂商中排名提升至第二

Core Viewpoint - Jiangsu Zhongke Kehua New Materials Co., Ltd. has applied for a change in its listing review status to "inquired" on the Sci-Tech Innovation Board, aiming to raise 598 million yuan for its semiconductor packaging materials business [1] Group 1: Company Overview - The company focuses on the research, production, and sales of semiconductor packaging materials, primarily epoxy molding compounds, which are essential materials in the semiconductor packaging process [1] - The company targets the mid-to-high-end market, with rapid growth in sales revenue from mid-to-high-end epoxy molding compounds, which are increasingly contributing to total sales [1] Group 2: Sales and Market Position - The company employs a direct sales model supplemented by trade, successfully overcoming technical bottlenecks in the epoxy molding compound sector and gaining recognition from downstream customers, leading to a steady increase in market share [2] - As of the date of the prospectus, the company has established long-term, stable partnerships with well-known downstream manufacturers, including China Resources Microelectronics and Galaxy Microelectronics, and has received awards such as "2023 Excellent Supplier" from China Resources Microelectronics [2] Group 3: Financial Performance - The company ranks second among domestic manufacturers in the epoxy molding compound business, with some mid-to-high-end products successfully replacing Japanese competitors [3] - Projected revenues for the years 2022 to 2025 are approximately 200 million yuan, 250 million yuan, 331 million yuan, and 159 million yuan respectively, with net profits of 4.74 million yuan, 10.03 million yuan, 33.90 million yuan, and 15.53 million yuan for the same periods [3] - Total assets and equity attributable to the parent company are expected to grow, with total assets reaching approximately 587.54 million yuan by June 30, 2025, and equity at approximately 406.50 million yuan [4]