四维图新调整募投项目布局，两项目延期并优化芯片研发子项目

Core Viewpoint - The company announced adjustments to its fundraising projects, including delays and changes in the layout of sub-projects under the "Intelligent Connected Vehicle Chip R&D Project" [2][3] Fundraising Project Adjustments - The company is postponing the expected usability dates for the "Intelligent Connected Vehicle Chip R&D Project" and the "Autonomous Driving Dedicated Cloud Platform Project" to December 2028 and December 2026, respectively [2][3] - The total amount of funds raised in 2020 was approximately 4 billion yuan, with a net amount of about 3.975 billion yuan after deducting issuance costs [2] Reasons for Delays - The delay in the "Intelligent Connected Vehicle Chip R&D Project" is attributed to a conservative chip procurement approach by automakers amid a plateau in the global electric vehicle market, along with increased design complexity due to the need for multi-functional integration [3] - The postponement of the "Autonomous Driving Dedicated Cloud Platform Project" is due to structural changes in the industry ecosystem, with a reduced urgency for independent cloud platforms as general AI platforms become mainstream [3] Terminated and New Sub-Projects - Two sub-projects, the Low-cost DA Chip AC8005 and the Visual Processing Chip AC6815, have been terminated due to market conditions and lack of competitive advantage [4] - Two new sub-projects have been added: the high-cost performance connected instrument SoC AC8117 and the high-performance 5G vehicle networking IVI SoC AC8277, which align with market trends and regulatory requirements [4] Fund Utilization - As of November 30, 2025, the company has invested 689 million yuan in the "Intelligent Connected Vehicle Chip R&D Project," accounting for 55.55% of the planned total, with approximately 669 million yuan remaining for ongoing and new projects [4]