中天精装：公司参股企业科睿斯半导体科技（东阳）有限公司主营FCBGA高端封装基板业务

Core Viewpoint - The company Zhongtian Precision Decoration announced its involvement in a semiconductor packaging business through its equity stake in CoreSys Semiconductor Technology (Dongyang) Co., Ltd, which focuses on FCBGA high-end packaging substrates for high-performance chips [1] Group 1: Company Developments - CoreSys is set to launch its first phase of production in September 2025, focusing on packaging for TPU, CPU, GPU, and AI chips [1] - The company is currently in the process of creating samples for certain clients, with progress reported as smooth [1] - Zhongtian Precision Decoration will continue to monitor and support the operational development of its equity stake in CoreSys, committing to timely information disclosure regarding any significant external investment or capital operation plans that may impact the company [1]