兴森科技：公司FCBGA封装基板已反馈封测结果均为未发现基板异常

Core Viewpoint - The company, Xingsen Technology, is actively engaging with chip design companies and packaging manufacturers as target customers for its packaging substrate business, while maintaining confidentiality regarding specific client collaborations [1] Group 1 - The company has confirmed that its FCBGA packaging substrate has received feedback from testing results indicating no abnormalities in the substrate [1]