德福科技取得超薄铜箔针孔测试方法专利

Group 1 - The State Intellectual Property Office of China has granted a patent to Jiujiang Defu Technology Co., Ltd. for a method of testing pinholes in ultra-thin copper foil, with the authorization announcement number CN119861082B and an application date of December 2024 [1] - Jiujiang Amber New Materials Co., Ltd., established in 2022, is located in Jiujiang and primarily engages in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 1,672.1872 million RMB [1] - Jiujiang Amber New Materials Co., Ltd. has participated in 33 bidding projects and holds 42 patent records, along with 9 administrative licenses [1] - Jiujiang Defu Technology Co., Ltd., founded in 1985, is also based in Jiujiang and focuses on non-ferrous metal smelting and rolling processing, with a registered capital of 630.322 million RMB [1] - Jiujiang Defu Technology Co., Ltd. has invested in 10 external companies, participated in 41 bidding projects, and holds 2 trademark records and 494 patent records, in addition to 15 administrative licenses [1]