中芯国际取得半导体结构形成方法专利

Core Insights - Semiconductor manufacturing company SMIC (Semiconductor Manufacturing International Corporation) has obtained a patent for a method of forming semiconductor structures, with the patent number CN120076397B, applied for on November 2023 [1] Company Overview - SMIC was established in 2000 and is located in Shanghai, primarily engaged in the manufacturing of computers, communications, and other electronic devices [1] - The company has a registered capital of 244 million USD [1] - SMIC has made investments in 4 companies and participated in 127 bidding projects [1] - The company holds 150 trademark registrations and 5000 patent records, along with 446 administrative licenses [1]