天准科技：8.72亿可转债12月31日在上交所上市

Group 1 - The company Tianzhun Technology announced the issuance of Tianzhun Convertible Bonds [1] - The total issuance amount is 872 million yuan, with an issuance volume of 872,000 lots [1] - The bonds will be listed on the Shanghai Stock Exchange, with a listing date set for December 31, 2025 [1]