USC(SH:688403) Xin Lang Cai Jing·2025-12-29 07:54Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, a year-on-year increase of 21.05%, and a net profit of 124 million yuan, up 23.21% from the previous year [9]. Group 2: Market Position and Financials - The company's main business involves high-end packaging and testing services for integrated circuits, with a revenue composition of 90.25% from display driver chip packaging and 9.75% from other services [3][8]. - As of the latest report, overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The company has a market capitalization of 14.148 billion yuan, with a trading volume of 361 million yuan and a turnover rate of 2.53% on December 29 [1].