IPO研究 | 全球导热界面材料市场销售额预计到2031年将增至41.48亿美元

Group 1 - Shenzhen Hongfucheng New Materials Co., Ltd. has received approval for its IPO on the ChiNext board, with Huayuan Securities as the sponsor [1] - Established in 2003, the company focuses on the R&D and industrialization of advanced electronic functional materials and devices, particularly in thermal management, electromagnetic shielding, and wave absorption [1] - The company's products are widely used in data centers (AI high-power chips, optical modules), smart vehicles, 5G communications, and consumer electronics [1] Group 2 - The global market for thermal interface materials (TIM) is projected to reach $2.012 billion in sales by 2024, with an expected growth to $4.148 billion by 2031, reflecting a compound annual growth rate (CAGR) of 10.74% from 2025 to 2031 [1] - In the domestic market, the thermal interface materials market in China is expected to reach $1.027 billion in 2024 and grow to $2.164 billion by 2031, with a CAGR of 11.09% [2] - The demand for electronic device cooling is anticipated to increase due to the "AI+" wave, particularly in data centers, ADAS, consumer electronics, and electric vehicles [5]