SoftBank(US:SOBKY) 3 6 Ke·2025-12-31 01:52Core Viewpoint - Fujitsu officially announced its participation in a next-generation AI memory development project led by SoftBank, aiming to create "SAIMEMORY" new memory technology to address the storage technology bottleneck for complex AI computations [1][2]. Group 1: Project Overview - The alliance includes Fujitsu, SoftBank, Intel, and the University of Tokyo, focusing on developing high-bandwidth memory (HBM) alternatives using 3D stacked DRAM technology [1]. - The project aims to enhance AI infrastructure by providing high-performance and cost-effective storage solutions, leveraging Fujitsu's quantum-inspired technologies [1][2]. Group 2: Technical Innovations - The project encompasses multiple innovative directions, including dynamic memory silicon combing and deep integration with photonic chips, which have shown superior performance in generative AI tasks compared to traditional silicon chips [1]. - Collaboration will integrate Intel's vertical stacking technology and the University of Tokyo's academic achievements in thermal management and data transmission [1]. Group 3: Financial and Strategic Aspects - The project plans to complete a total investment of 8 billion yen (approximately 359 million RMB) by the fiscal year 2027, with SoftBank contributing 3 billion yen and Fujitsu along with RIKEN contributing 1 billion yen [3]. - The project aims to develop prototype samples within two years and seeks to commercialize the new memory technology in the 2020s, with SoftBank prioritizing its application in its AI training data centers [3]. Group 4: Market Context - The current memory market is experiencing price increases, particularly for HBM, which is essential for AI devices but has high power consumption and costs [4]. - The SAIMEMORY project targets these market pain points, aiming for a 2-3 times capacity increase and a 50% reduction in power consumption compared to existing HBM solutions [4]. Group 5: Industry Positioning - Japan's semiconductor industry has struggled in the memory sector, with Fujitsu previously exiting DRAM to focus on specialized chips, while competitors like Elpida have declined [5]. - Despite not selling products, Japan maintains a strong position in semiconductor equipment and materials, which supports the competitiveness of the SAIMEMORY initiative [5]. Group 6: Challenges Ahead - The project faces challenges such as the production stability of 3D stacked DRAM technology, cost control, and market acceptance, with South Korean companies holding a 90% market share in HBM [6]. - This collaboration represents Japan's attempt to re-enter the global semiconductor competition through AI advancements, with the commercialization progress likely to impact the global AI storage market [6].