2025年中国高速互连芯片行业政策、产业链、市场规模、竞争格局及发展趋势研判:行业正处于快速发展阶段，预计2030年中国市场规模超140亿美元[图]

Core Insights - The high-speed interconnect chip market is experiencing exponential growth driven by the surge in computing power demand due to the AI wave, particularly the rapid development of large models [1][3] - The global high-speed interconnect chip market is projected to reach $15.5 billion in 2024, with China's market size estimated at $3.875 billion, accounting for approximately 25% of the global market [1][5] - By 2030, the global market is expected to grow to $49 billion, with China's market projected to reach $14.7 billion, increasing its share to about 30% [1][5] Industry Definition and Classification - High-speed interconnect chips are essential components for enabling high-speed data exchange in data centers, servers, and computers, addressing bottlenecks in data transmission amid the ongoing upgrade of intelligent computing systems [2][3] - These chips are categorized into communication, computing, and storage types based on application areas, and further classified into memory interconnect chips, PCIe/CXL interconnect chips, and Ethernet/optical interconnect chips based on technology [2] Current Development Status - The demand for high-speed interconnect chips is rapidly increasing due to the AI boom, with the global market size expected to reach $15.5 billion in 2024, including $1.2 billion for memory interconnect chips, $2.3 billion for PCIe/CXL interconnect chips, and $12 billion for Ethernet/optical interconnect chips [3][4] - By 2030, the market is projected to grow to $49 billion, with memory interconnect chips reaching $5 billion, PCIe/CXL interconnect chips $9.5 billion, and Ethernet/optical interconnect chips $34.5 billion [3] Industry Chain - The industry chain consists of upstream semiconductor materials and IP core design, midstream chip design and production, and downstream applications primarily in servers, communication, data centers, and AI [5][6] - The demand for high-speed interconnect chips in AI servers is a key driver for market expansion [5][7] Policy Environment - The chip industry is receiving significant attention and support from national policies in China, which recognize high-speed interconnect chips as a core component of computing infrastructure [9] - Various policies have been implemented to promote the development of the high-speed interconnect chip industry, including the "Computing Power Interconnection Action Plan" and the "2025-2026 Electronic Information Manufacturing Industry Growth Action Plan" [9] Competitive Landscape - Major players in the high-speed interconnect chip market include companies like Lanqi Technology, Renesas Electronics, Rambus, Muxi Technology, and Micron Technology [11][12] - The market is highly concentrated, with the top three companies holding a combined market share of 93.4% in 2024, where Lanqi Technology leads with a 36.8% share, followed by Renesas Electronics at 36% and Rambus at 20.5% [12] Development Trends - The high-speed interconnect chip industry is witnessing a demand explosion driven by advancements in AI, big data, and other technologies, leading to continuous protocol iterations, technological breakthroughs, and an expanding range of application scenarios [13][14] - The market is expected to see a concentration towards leading companies as the industry evolves [13]