兴森科技：公司FCBGA封装基板项目市场拓展、客户认证均按计划稳步推进中

Core Viewpoint - The company is progressing steadily in the market expansion and customer certification of its FCBGA packaging substrate project, and the operational situation will be detailed in future regular reports [2][4]. Group 1 - Investors inquired about whether the certification and introduction speed of key customers for the ABF substrate is below expectations [2][4]. - There are concerns regarding whether the idle high-end capacity will impact this year's financial report [2][4].