【IPO追踪】布局“A+H”,半导体龙头兆易创新开启招股
Sou Hu Cai Jing·2025-12-31 08:05

Group 1 - The core viewpoint of the news is that the semiconductor sector in the Hong Kong stock market is performing exceptionally well, with companies like Zhongji Innovation planning to launch an IPO to capitalize on this trend [3][4]. - Zhongji Innovation plans to globally issue approximately 28.92 million H-shares, with 10% allocated for public offering in Hong Kong and 90% for international offering, along with a 15% overallotment option [3]. - The expected net fundraising amount is approximately HKD 4.181 billion, with 40% allocated for enhancing R&D capabilities, 35% for strategic investments and acquisitions, 9% for global expansion, 6% for improving operational efficiency, and 10% for working capital and other general corporate purposes [3][4]. Group 2 - Zhongji Innovation has attracted significant interest from institutional investors, with cornerstone investors including Jinglin Asset, Taikang Life, Yunfeng Fund, and Xinhua Asset Management, collectively planning to subscribe for approximately USD 299.7 million of the offered shares [4]. - The company is a diversified integrated circuit design firm, providing a range of chip products including Flash, niche DRAM, microcontrollers (MCUs), analog chips, and sensor chips for various applications such as consumer electronics, automotive, industrial automation, and IoT [4]. - According to Frost & Sullivan, Zhongji Innovation ranks second globally and first in mainland China in the NOR Flash segment with an 18.5% market share, seventh globally and second in mainland China in niche DRAM with a 1.7% market share, and eighth globally and first in mainland China in the MCU segment with a 1.2% market share [4]. Group 3 - The company's revenue for the years 2022 to 2024 and the first half of 2025 is reported as RMB 8.13 billion, RMB 5.76 billion, RMB 7.36 billion, and RMB 4.15 billion respectively, with adjusted net profits of RMB 2.26 billion, RMB 0.26 billion, RMB 1.26 billion, and RMB 0.67 billion [5].

GigaDevice-【IPO追踪】布局“A+H”,半导体龙头兆易创新开启招股 - Reportify