凯格精机：公司的封装设备主要应用于半导体及LED封装环节的固晶工序

Core Viewpoint - The company Keg Precision Machinery specializes in packaging equipment primarily used in the semiconductor and LED packaging processes, specifically in the die bonding stage [1] Group 1: Company Overview - Keg Precision Machinery's die bonding equipment automates the process of transferring bare chips from wafers to carrier substrates or lead frames, ensuring the fixation or adhesion of chips [1] - The die bonding equipment is applicable in various sectors, including LED lighting, display devices, and semiconductor chip packaging [1] Group 2: Industry Applications - In the semiconductor field, the die bonding equipment can be utilized for products such as QFN, DFN, SMA, SOD, roll-type SIM, and in co-bonding processes for automotive-grade mounting, optical communication mounting, and COB high-power applications [1]