汇成股份涨0.00%，成交额8.93亿元，近3日主力净流入230.14万

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Overview - Hefei Xinhui Microelectronics Co., Ltd. specializes in high-end integrated circuit packaging and testing services, with its main products being integrated circuit packaging tests [3]. - The company was established on December 18, 2015, and went public on August 18, 2022. Its main business involves gold bumping, wafer testing, and various packaging processes, contributing to a comprehensive service capability for display driver chips [8]. Group 2: Business Developments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and formed a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging businesses [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, to meet customer demands and enhance its technological capabilities [2]. Group 3: Financial Performance - For the period from January to September 2025, the company achieved a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [9]. - As of September 30, 2024, the company's overseas revenue accounted for 54.15%, benefiting from the depreciation of the yuan [4].