Group 1 - Baidu's Kunlun Chip has submitted a listing application to the Hong Kong Stock Exchange, aiming for an independent IPO by January 1, 2026 [1] - Kunlun Chip, an AI chip company, was previously part of Baidu's Intelligent Chip and Architecture Department and became an independent entity in April 2021 [1] - The spin-off is expected to enhance Kunlun Chip's operational and financial transparency, allowing investors to independently assess its performance and potential [1] Group 2 - Reports of Kunlun Chip's IPO plans surfaced in December 2025, with a target to complete the IPO by early 2027, and a recent funding round raised over 2 billion yuan, valuing the company at 21 billion yuan [2] - Kunlun Chip is projected to achieve over 3.5 billion yuan in revenue by 2025 and reach breakeven [2] - Baidu plans to launch the M100 chip in early 2026 and the M300 chip in early 2027, targeting large-scale inference and multimodal model training needs [2] Group 3 - Baidu is set to release the "Tianchi 256 Super Node" and "Tianchi 512 Super Node" in the first and second halves of 2026, respectively, featuring the Kunlun Chip P800 [4] - The super node products will support up to 256 and 512 interconnected cards, with plans for thousand-card and four-thousand-card nodes starting in the second half of 2027 [4] - The decision to disclose the AI chip roadmap is influenced by competitive pressures and the upcoming IPO of Kunlun Chip [4]
百度旗下昆仑芯已向港交所秘密提交IPO申请