Group 1 - Kunlun Chip, a semiconductor subsidiary of Baidu focused on AI chip development, is advancing its plan for a Hong Kong IPO by submitting the A1 form to the Hong Kong Stock Exchange [1] - The IPO plan aims to achieve global offerings, including a public offering to the Hong Kong public and allocations to institutional and professional investors [1] - The latest financing round for Kunlun Chip has reached an estimated valuation of approximately 21 billion RMB (about 2.97 billion USD) [3] Group 2 - Baidu confirmed on December 7 that it is evaluating the spin-off and listing plan for Kunlun Chip, noting that the process requires regulatory approval and does not guarantee implementation [3] - Following the news of the IPO plans, Baidu's stock price increased by 5% on the same day [3] - Kunlun Chip is positioned as an important player in Baidu's AI chip strategy, with products primarily used in data centers, cloud computing, and autonomous driving [3]
百度1月2日公告：昆仑芯提交香港上市申请，分拆上市计划进入新阶段
Sou Hu Cai Jing·2026-01-02 03:13