Core Viewpoint - The recent launch of the fourth phase project by Jinghe Integrated Circuit, with a total investment of 35.5 billion yuan, marks a significant expansion in the company's production capacity and technological capabilities in the semiconductor industry [2][10]. Investment and Production Capacity - The fourth phase project involves the construction of a 12-inch wafer foundry production line, with a planned monthly capacity of 55,000 wafers [3][11]. - Upon completion, the total production capacity of Jinghe Integrated Circuit will increase to approximately 170,000 wafers per month, solidifying its leading position among wafer foundries in mainland China and ranking ninth globally [7][15]. Technological Focus - The production line will focus on advanced process nodes of 40nm and 28nm, targeting applications in CMOS image sensors (CIS), OLED display driver chips, and logic chips [3][11][12]. - The project aims to meet the market demands of cutting-edge applications, including OLED display panels, AI smartphones, AI computers, smart vehicles, and various artificial intelligence devices [5][13]. Historical Context and Previous Phases - Jinghe Integrated Circuit's first phase project began construction in October 2015 and was officially put into production in October 2017, with both the first and second phases now operating at full capacity [6][14]. - The third phase project, with a total investment of 21 billion yuan and a monthly capacity of 50,000 wafers, is expected to commence production in August 2024 [6][14]. Financial Backing and Future Plans - The third phase project has received significant capital increases from various institutional investors, including state-owned banks, raising its registered capital to approximately 9.59 billion yuan, which will be used for equipment procurement and operations [8][16]. - The fourth phase project is scheduled to begin equipment installation in the fourth quarter of 2026 and aims to reach full production by the second quarter of 2028 [17].
重磅!合肥晶圆龙头,355亿元项目动工!