帝尔激光TGV激光微孔设备出口订单顺利发货

Core Viewpoint - The company, Dier Laser, has successfully shipped export orders for panel-level laser micro-hole equipment used in glass substrate semiconductor packaging, marking a significant step in the industrialization of Through-Glass Via (TGV) technology [1] Group 1 - Dier Laser's recent shipment of equipment indicates progress in TGV technology [1] - The successful export orders highlight the company's capabilities in semiconductor packaging solutions [1]