【大涨解读】半导体：存储迎来新一轮大提价，海外半导体设备连续大涨创历史新高，全球资本扩张点燃半导体设备新预期

Group 1 - The semiconductor sector experienced a significant rally on January 6, with companies like Lian Micro, Jinhai Tong, and Yaxiang Integration seeing consecutive gains, while Strongly New Materials hit the daily limit up [1] - Samsung and SK Hynix announced a price increase for DRAM products, with prices expected to rise by 60%-70% in Q1 2023 compared to Q4 2022 [3] - Goldman Sachs raised TSMC's 12-month target price by 35% to NT$2,330, citing TSMC's technological leadership and opportunities from the AI industry [3] Group 2 - The storage industry is experiencing both volume and price increases, with domestic companies benefiting from the trend towards localization. The global demand for high-end storage products like HBM and DDR5 is expected to surge, with a projected CAGR of 33% from 2024 to 2030 [5] - Changxin Technology, a leading domestic DRAM manufacturer, submitted an IPO application to raise CNY 29.5 billion for capacity upgrades and R&D, which is expected to accelerate the maturation of the domestic storage industry [4][5] - AI-related semiconductor revenue is projected to grow from less than 10% to 48% of total semiconductor revenue from 2020 to 2030, while non-AI semiconductor growth is slowing [5] Group 3 - The semiconductor equipment industry is entering a high-growth cycle driven by AI and self-sufficiency, with the global semiconductor market expected to grow by 9% to USD 760.7 billion by 2026 [6] - Domestic wafer fabs are seeing a recovery in capacity utilization, with companies like SMIC and Huahong reaching utilization rates of 95.8% and 109.5%, respectively [6] - Investment focus is shifting towards platform leaders, niche market leaders, and high-elasticity breakthrough targets, while also considering opportunities in advanced packaging equipment localization [6]