AMD推出下一代新品，4年内AI芯片性能有望提升1000倍

Core Insights - AMD's CEO Lisa Su announced the next-generation AI chip MI455 GPU at CES, which will be manufactured using 2nm and 3nm processes and will feature advanced packaging with HBM4 [1] - The MI455 GPU will be integrated with the EPYC CPU, and the next-generation AI rack, Helios, will include 72 GPUs, enabling the construction of large AI clusters by connecting thousands of Helios racks [1] - The MI500 series chips are also in development, expected to utilize 2nm technology, with AMD aiming to enhance AI performance by 1000 times over the next four years with the launch of the MI500 series in 2027 [1]