Core Insights - The Active Copper Cable Multi-Source Agreement (ACC-MSA) has been established to enhance interoperability and innovation in next-generation copper interconnect solutions [1][5] - The consortium aims to address key industry challenges by reducing power, cost, and latency while improving performance for high-speed copper interconnects [1][5] Group 1: Consortium Formation - Thirteen global leaders in networking, semiconductors, and cabling have formed the ACC-MSA, co-chaired by MACOM and Semtech [2] - Founding members include major companies such as AMD, Cisco, Dell Technologies, NVIDIA, and others [2] Group 2: Technical Focus - The initial focus of the ACC-MSA is on optimized copper interconnects featuring integrated linear equalizers [3] - Specifications will cover electrical, firmware, and testing requirements to ensure interoperability among various vendors [3] Group 3: Industry Impact - The integration of linear equalizers is expected to extend the reach of copper cabling, reduce thickness, and lower power consumption and latency compared to traditional DSP-based solutions [4] - AI hardware infrastructure spending is projected to exceed $1 trillion by 2029, with networking infrastructure nearing $200 billion, highlighting the importance of ACCs in future deployments [4]

美国银行全球研究部将AMD股票从美国1号股票名单中移除。 来源：滚动播报 ...

Core Viewpoint - Advanced Micro Devices (AMD) has experienced significant stock volatility in 2026, with a notable decline following its Q4 2025 earnings announcement, leading to a 23% drop from its recent high and a 24% drop from its all-time high established in late 2025 [1] Group 1: Stock Performance - AMD's stock started the year at approximately $210, surged to over $250 by the end of January, and then fell sharply after the earnings report [1] - The stock is currently down nearly 23% from its recent high and about 24% from its all-time high [1] Group 2: Market Position and Competitors - AMD has historically been compared to Intel and is now often compared to Nvidia, particularly in the artificial intelligence sector [2] - The company has struggled to capture significant market share in data center computing units, but management believes recent changes will help improve this situation [3] Group 3: Financial Performance and Projections - AMD's management provided guidance indicating that the data center division is expected to grow at a 60% compounded annual growth rate (CAGR) through 2030, while the overall CAGR is projected to be around 35% [3] - In Q4, AMD reported a revenue growth of 34%, meeting internal expectations, with data center revenue increasing by 39% year over year, which is below the 60% CAGR forecast but shows improvement from a 22% growth in Q3 [3] Group 4: Future Outlook - While AMD's recovery is not yet complete, the company is perceived to be on the right track, and the recent sell-off is viewed as unwarranted [4] - There is an expectation that results will improve throughout 2026, suggesting a potential buying opportunity for investors [4]

在整体系统配置方面，AMD两款APU 均将搭载Zen 6 CPU核心。Point与Halo版本的区分方式将与现在 的APU类似。 Medusa Point采用Zen 6+Zen 6c大小核混合架构。 规格更高的Medusa Halo则配备纯Zen 6 核心，以实现最强CPU性能。 AMD下一代Ryzen 500 系列APU（代号Medusa Point / Medusa Halo）规格近日曝光。 据悉Medusa Point将采用RDNA 4的衍生版本RDNA 4m核显，这大概率是面向笔记本与迷你主机的移动 版架构。 与之相对，Medusa Halo则会使用AMD下一代RDNA 5 / UDNA GPU微架构。Medusa Point还将推出桌面 专属版 RDNA 4，也就是这款新的RDNA 4m变体。 近期消息显示，该平台将采用LPDDR6内存，相比目前主流的LPDDR5X，内存带宽将提升50%。 值得 关注的是，这将是AMD未来数年内首次弃用基于RDNA 3.5的核显设计。 (11381784) ...

2025年，全球半导体产业迎来一个历史性拐点。 根据Gartner统计，全球半导体总营收达到7930亿美元，同比增长21%。这一强劲反弹不仅终结了此前的周期性低迷，更昭示着行业增长逻辑的根本转向。 过去十年由"移动互联网+云计算"主导的叙事正在退场，取而代之的是以AI基础设施为核心的新引擎。AI处理器、高带宽内存（HBM）和高速互连芯片， 正以前所未有的速度重塑产业版图。曾经稳坐钓鱼台的巨头悄然滑落，而押中AI赛道的玩家则一飞冲天。全球半导体TOP10的座次变动，已不再是简单的 数字游戏，而是一场关于生态、战略与时代判断的深度洗牌。 01 2024 vs 2025，新王加冕 2025年的榜单，最震撼的不是谁上榜，而是差距被拉得如此之大。英伟达不仅稳坐头把交椅，更以一骑绝尘的姿态，将第二名远远甩在身后。 | 2025排名 | 2024排名 | 厂商 | 2025营收 | 2024营收 | 2025-2024增长率(%) | | --- | --- | --- | --- | --- | --- | | 1 | 1 | 英伟达 | 125,703 | 76,692 | 63.9 | | 2 | 2 | 三星电子 ...

格隆汇2月23日｜特斯拉、美国超微公司、博通夜盘跌超1%，Bitmine Immersion Technologies跌超3%， Strategy、Coinbase跌超2%，Robinhood、Circle跌近2%。 ...

每经AI快讯，2月23日，美股明星科技股、加密货币概念股夜盘普跌，特斯拉、美国超微公司、博通跌 超1%；Bitmine Immersion Technologies跌超3%， Strategy、Coinbase跌超2%，Robinhood、Circle跌近 2%。 ...

（原标题：玻璃，革命芯片？） 过去半个世纪以来，人类一直痴迷于让事物"更小"。这是在单个芯片上集成更多晶体管的唯一途径。将 晶体管缩小到10纳米、5纳米和3纳米，正是半导体技术的定义。但最终，物理定律给出了冷酷的判 决："你不可能再缩小了。" 对此，人们改变了想法。 "如果我们不能缩小单个单元的尺寸，为什么不把几个单元组合起来建造更大的东西呢?" 这一个问题改变了游戏规则。如今，核心关注点不再是芯片内部的微观电路，而是连接芯片的"桥梁"以 及支撑它们的"接地"。纳米级战争已经结束，微米级战争已经开始。 而在这片战场的正中央，矗立着一块透明的玻璃。 为什么芯片不能再大了 人工智能模型越来越大，芯片上需要集成的晶体管数量也随之增加。为了容纳更多晶体管，芯片尺寸必 须增大——但芯片尺寸存在一个无法突破的极限。 这就是良率问题。不能再小了，也不能再大了。单片芯片是条死路。 所以，业界的应对之策是反其道而行之。 分开，然后重新连接 想象一下，用3D打印机一次性打印出一座霍格沃茨城堡。如果打印过程中出现一个地方出错，整个作 品就得扔掉。但如果你用乐高积木搭建呢?一块坏的积木——换一块就行了。 Chiplet就像乐高积木。 ...

Group 1 - Major tech companies are committing to invest hundreds of billions of dollars into AI initiatives in India, with a total capital expenditure potentially reaching $700 billion this year [1] - Indian tech group Reliance plans to invest $110 billion into data centers and infrastructure, while Adani has outlined a $100 billion AI data center buildout over the next decade [2] - Microsoft announced its intention to invest $50 billion in AI in the Global South by the end of the decade, alongside partnerships between OpenAI, AMD, and Tata Group to enhance AI capabilities [3] Group 2 - The announcements of these investments were made during a significant summit, which also faced controversy, including Bill Gates withdrawing due to backlash over his past associations [4]

英伟达(NVDA.US)通过扶持CoreWeave构建的"算力-金融"闭环实在太诱人，逼得谷歌(GOOGL.US)和 AMD(AMD.US)不得不"摸着石头过河"，试图用真金白银砸出一个属于自己的AI芯片生态圈。 2月20日，据媒体援引知情人士消息，谷歌正在探索利用其雄厚的财力来构建更广泛的AI生态系统，核 心策略就是向数据中心合作伙伴提供资金支持，条件是对方必须使用谷歌的TPU芯片。与此同时，华尔 街见闻写道，AMD也在通过为客户贷款提供担保的方式，激进地推广其AI芯片。 这一策略被市场视为对英伟达"CoreWeave模式"的直接复刻——即通过扶持"新兴云（Neocloud）"厂 商，绕开已经被英伟达占领或自研芯片的传统云巨头，建立自己的"嫡系部队"。 效仿英伟达路线：注资"新型云"与矿企 知情人士透露，谷歌正在洽谈向云计算初创公司Fluidstack投资约1亿美元。这笔交易对Fluidstack的估值 约为75亿美元。 这种做法虽然能短期推高销量，但也让芯片厂商在AI需求放缓时面临巨大的风险敞口。一旦市场遇 冷，AMD的资产负债表将直接承受冲击。 为何都要绕路走？ 这不仅是一笔财务投资，更是一次战略绑定。 ...