Core Viewpoint - Micron plans to increase its HBM4 monthly production capacity to 15,000 wafers by 2026, representing nearly 30% of its total HBM capacity of approximately 55,000 wafers per month, indicating a strategic focus on the next-generation AI memory market [1] Group 1: Production Capacity and Strategy - Micron has historically lagged behind Korean competitors in HBM capacity but is now changing this situation [1] - The CEO, Sanjay Mehrotra, announced during the December 2025 earnings call that significant HBM4 production increases will begin in the second quarter of 2026 [1] - The company expects the yield ramp-up speed for HBM4 to surpass that of the previous generation, HBM3E [1] Group 2: Investment and Development - Micron has initiated equipment investments to accelerate capacity construction [1]
美光据报加速HBM4芯片扩产,月产能将提升至1.5万片