有研粉材：公司目前能够应用在散热场景的铜粉产品共有三类

Core Viewpoint - The company has developed three types of copper powder products for heat dissipation applications, addressing high thermal demand scenarios in various technologies [2] Group 1: Product Types - The first type is a new heat dissipation copper powder designed for high thermal demand applications, specifically for GPU and NPU, and is the first of its kind in the industry, currently used in Huawei's Ascend 910B chip [2] - The second type is copper powder for MIM applications, used in the production of pin-fin heat dissipation substrates, with over 3,000 tons supplied externally for IGBT heat sinks [2] - The third type is 3D printing copper powder, which is currently in the verification and promotion stage, not yet in mass supply, primarily for new liquid cooling heat exchangers and specialized conductive components [2]