Hyundai Mobis and Qualcomm Sign Comprehensive Agreement to Collaborate on SDV architecture for ADAS

MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets TM Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using Qualcomm's Snapdragon Ride Flex system-on-chip Companies' agreement extends beyond ADAS development, with plans to deliver broader SDV solutions based on Snapdragon automotive technologies LAS VEGAS, Jan. 7, 2026 /PRNewswire/ -- Hyundai Mobis and Qualcomm Technologies Inc. announced today tha ...