Hyundai Mobis and Qualcomm Sign Comprehensive Agreement to Collaborate on SDV architecture for ADAS

Core Insights - Hyundai Mobis and Qualcomm Technologies Inc. have signed a comprehensive agreement to co-develop next-generation solutions for Software-Defined Vehicles (SDV) and Advanced Driver Assistance Systems (ADAS) at CES 2026 [1][6] Group 1: Collaboration Details - The MOU signing was attended by key executives from both companies, indicating a high-level commitment to the partnership [2] - The collaboration aims to develop integrated solutions tailored for emerging markets, leveraging Hyundai Mobis's expertise in system integration and sensor fusion alongside Qualcomm's leadership in system-on-chip (SoC) technology [3] Group 2: Focus Areas - The initial focus will be on co-developing advanced driving and parking solutions based on Qualcomm's Snapdragon Ride Flex SoC, targeting fast-growing markets like India where ADAS adoption is increasing [4] - Future SDV applications will involve creating integrated solutions that combine Hyundai Mobis's standardized software platform with Qualcomm's Snapdragon automotive technologies to enhance performance, efficiency, and stability [4] Group 3: Strategic Initiatives - Hyundai Mobis hosted a private exhibition booth at CES 2026 to showcase its strategy of expanding into new business areas, including robotics, SDV solutions, and semiconductors, with over 200 representatives from major customers visiting for discussions [5]