黑芝麻智能五赴CES,三大领域最新突破推动智能全维进化

Core Insights - Black Sesame Intelligence showcased its latest achievements in assisted driving, embodied intelligence, and consumer electronics at CES 2026, marking its strategic shift from "driving assisted driving" to "promoting intelligent evolution" [1] Group 1: Assisted Driving Technology - The A2000 all-scenario general-purpose assisted driving demonstration platform made its debut, focusing on providing high-performance, reliable full-stack solutions for the smart automotive industry [3] - The Huashan A2000 chip has gained widespread recognition in the industry, with collaborations established with major automotive companies like Dongfeng, Geely, Hongqi, and JAC, successfully integrating assisted driving technology into mass-produced vehicles [4] - The Huashan A2000 chip, featuring a large-core architecture and algorithmic collaboration design, has been optimized for performance, comparable to the highest-performing smart driving chips globally [4] Group 2: Cross-Domain Integration - The Wudang C1296 integrated cockpit solution made its overseas debut, developed in collaboration with Dongfeng Motor and Junlian Smart, utilizing a single C1296 chip for digital dashboards, smart cockpits, and assisted driving functions [6] - The Wudang series chips are pivotal in advancing automotive electronic and electrical architecture towards cross-domain integration, with high-integration mass production solutions launched by partners like Dongfeng, Continental Group, and Zebra Smart Mobility [6] Group 3: Embodied Intelligence - The SesameX multidimensional embodied intelligence computing platform made its first overseas appearance, aimed at providing an open, scalable, and mass-producible intelligent computing foundation for robots [7] - The SesameX platform includes three series—Kalos, Aura, and Liora—catering to various complexities and forms of robotic needs, promoting the large-scale industrial deployment of embodied intelligence [7] Group 4: Consumer Electronics - Black Sesame's AI imaging solutions have been widely adopted in consumer electronics, with over 500 million devices globally equipped with these technologies [10] - The recent strategic acquisition of Yizhi Electronics enhances Black Sesame's capabilities in low-power, cost-effective AI SoC chips, showcased at CES [10] - The AI imaging solutions cover a range of products, including smartphones, tablets, cameras, and AI glasses, providing enhanced user experiences through deep integration of chips and algorithms [10]

GXSH-黑芝麻智能五赴CES,三大领域最新突破推动智能全维进化 - Reportify