USC(SH:688403) Xin Lang Cai Jing·2026-01-08 07:34Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is actively expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, benefiting from the demand surge driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a strategic investment in Hefei Xinfeng Technology Co., Ltd., acquiring a 27.5445% stake and forming a partnership to develop 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, a year-on-year increase of 21.05%, and a net profit of 124 million yuan, up 23.21% [9]. Group 2: Business Operations - The main business of Hefei Xinhui Microelectronics is high-end integrated circuit packaging and testing services, with a revenue composition of 90.25% from display driver chip packaging [3][8]. - The company has established a significant customer base in the OLED sector, including major players like Novatek and Raydium [2]. - As of the latest report, overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. Group 3: Market Performance - On January 8, the company's stock rose by 8.98%, with a trading volume of 1.332 billion yuan and a market capitalization of 15.815 billion yuan [1]. - The average trading cost of the stock is 16.54 yuan, with the stock price approaching a resistance level of 18.38 yuan, indicating potential for upward movement if the resistance is broken [7].