世运电路：公司已开展TGV玻璃基板前瞻性研究与布局

Core Viewpoint - The company is actively researching and developing TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and engaging in upstream and downstream communication related to glass substrate processes and key links in the industry chain [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]