Montage Technology(SH:688008) Xin Lang Cai Jing·2026-01-08 12:25Group 1 - The core point of the news is that Chinese semiconductor design company, Montage Technology, plans to conduct a secondary listing in Hong Kong, aiming to raise between $800 million to $1 billion, which would mark the largest IPO in Hong Kong since September last year [1] - Montage Technology has already passed the listing hearing with the Hong Kong Stock Exchange and is expected to list on January 26, although the timeline is not yet finalized [1] - The surge in IPO activities for AI and semiconductor companies in Hong Kong and mainland China is driven by the country's push to enhance domestic technological capabilities and reduce reliance on U.S. technology [1] Group 2 - Montage Technology, established in 2004, specializes in fabless integrated circuit design, focusing on improving data transmission speeds between chips in servers and data centers [2] - The company was previously listed on NASDAQ in September 2013, raising $71 million, but was privatized a year later by a state-owned investment firm [2] - As of now, Montage Technology has a market capitalization of approximately $22 billion, with its stock price nearly doubling over the past year [2] - According to the company's prospectus, it is projected to hold a 36.8% market share in the global memory interconnect chip market by 2024 [2] - For the fiscal year 2023 to 2024, Montage Technology expects a revenue growth of 59% year-on-year, reaching 3.64 billion RMB (approximately $521.27 million), with a net profit of 1.34 billion RMB and a gross margin exceeding 58% [2] - The funds raised from the upcoming listing will be allocated to enhance R&D in interconnect chips, marketing activities, and seeking strategic investment opportunities [2]