TFME(SZ:002156) Zheng Quan Shi Bao Wang·2026-01-09 11:05Core Viewpoint - Tongfu Microelectronics (002156) plans to raise up to 4.4 billion yuan through a private placement of shares to enhance its production capacity in various sectors, including storage chip packaging and testing, automotive applications, wafer-level packaging, and high-performance computing and communication fields [1]. Group 1 - The company aims to use the raised funds for capacity enhancement projects in storage chip packaging [1]. - The funds will also support capacity improvements in packaging for emerging applications such as automotive [1]. - Additional allocations include wafer-level packaging capacity enhancement projects [1]. Group 2 - The company intends to improve its capacity in high-performance computing and communication packaging [1]. - The funds will be utilized to supplement working capital and repay bank loans [1].