TFME(SZ:002156) Mei Ri Jing Ji Xin Wen·2026-01-09 11:05Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to issue A-shares to specific investors, aiming to raise up to 4.4 billion yuan for various capacity enhancement projects and to supplement working capital and repay bank loans [1] Group 1: Fundraising Purpose - The company intends to use the raised funds for the enhancement of packaging and testing capacity in storage chips [1] - Funds will also be allocated to improve packaging and testing capacity in emerging applications such as automotive [1] - Additional investments will focus on wafer-level packaging capacity enhancement and high-performance computing and communication sectors [1] Group 2: Financial Strategy - The fundraising will also support the company's working capital needs [1] - Part of the funds will be utilized to repay existing bank loans [1]