通富微电：拟向特定对象增发募资不超过44亿元

Group 1 - The company Tongfu Microelectronics announced a plan to issue shares to specific investors, approved by its board of directors, with a maximum of 35 eligible investors [1] - The total number of shares to be issued will not exceed approximately 455 million shares, which is 30% of the company's total share capital prior to the issuance [1] - The issuance price will be no less than 80% of the average trading price of the company's shares over the 20 trading days prior to the pricing benchmark [1] Group 2 - The company aims to raise up to 4.4 billion yuan through this issuance, with funds allocated for various projects including enhancing packaging capacity for storage chips, automotive applications, wafer-level packaging, and high-performance computing [1] - Specific project investments include approximately 880 million yuan for storage chip packaging, 1.1 billion yuan for automotive applications, 743 million yuan for wafer-level packaging, and 724 million yuan for high-performance computing [1] - Additionally, 1.23 billion yuan will be used to supplement working capital and repay bank loans [1]