赛腾股份：部分MO检查设备客户已验收

Core Viewpoint - The company is progressing as planned with various inspection equipment for semiconductor manufacturing, and some equipment has already been accepted by customers [1] Group 1: Equipment Development - The company is advancing its MO inspection equipment, graphic wafer defect detection, SiC wafer defect detection, wafer micro-crack detection, wafer thickness measurement, and wafer hole detection [1] - Some of the equipment has already been accepted by customers, indicating successful implementation and customer satisfaction [1] Group 2: Communication and Updates - The company will regularly update its official website to provide information on its progress and developments [1]