芯片制程“破2进1” “1.4纳米”2027年或试产

Core Insights - TSMC has officially announced the mass production of its 2nm process in Q4 2025 and has begun research and development on the next-generation 1.4nm process, with risk trial production expected to start in 2027 [3][4][5] - TSMC's advancements solidify its dominant position in the semiconductor foundry market, marking the industry's transition into the 1nm era, with competitors like Samsung and Intel striving to catch up [3][4][7] TSMC's 2nm and 1.4nm Processes - The 2nm process (N2) utilizes the first-generation nanosheet transistor architecture, showing significant improvements over the previous 3nm process, including a 10%-15% performance increase at the same power consumption and a 25%-30% reduction in power consumption for the same performance [5][6] - TSMC's CEO stated that the 2nm process is expected to ramp up production significantly by 2026, driven by demand from smartphones and AI/HPC [5][6] - The 1.4nm process is seen as a strategic continuation of TSMC's "incremental smaller nodes" approach, with plans to optimize the N2 process while preparing for the next generation [5][6] Competitive Landscape - Samsung and Intel are TSMC's main competitors, with Samsung having achieved 3nm GAA process mass production and planning to launch its 1.4nm process around 2027 [7][8] - Intel aims to regain its manufacturing leadership with its 18A and 14A processes, leveraging significant investments to expand domestic production capacity [9][10] Market Potential and Applications - The transition to 1.4nm is expected to drive growth in the semiconductor industry, particularly in AI chips, smart driving, and high-end consumer electronics [10][11] - The global advanced process foundry market is projected to exceed $120 billion by 2030, with 1.4nm and below nodes expected to account for over 40% of high-end logic chip value [10][11] Pricing and Profitability - Initial foundry prices for the 1.4nm process are expected to be approximately 50% higher than those for the 3nm process, indicating high R&D costs but potentially significant long-term profits [11][12] - TSMC's ability to quickly improve yield rates and secure major clients could further enhance its competitive advantage in the high-end market [11][12] Chinese Market Dynamics - Chinese companies, represented by SMIC, are increasing their production capacity in mature processes while investing in advanced technology R&D, with projections suggesting that China could hold 30% of global wafer foundry capacity by 2030 [12]