TFME(SZ:002156) Ju Chao Zi Xun·2026-01-10 01:06Core Viewpoint - Tongfu Microelectronics plans to raise up to 4.4 billion yuan through a private placement of A-shares to enhance its capabilities in high-end chip packaging and testing, focusing on four key projects to strengthen its competitive advantage in the semiconductor packaging industry [1][3]. Group 1: Fundraising and Investment Projects - The company aims to invest in four core packaging capacity enhancement projects and supplement working capital, targeting high-growth and high-tech sectors for systematic improvement in packaging capabilities [1][3]. - The projects include enhancements in automotive packaging capacity to meet strict automotive electronic standards, as well as improvements in storage chip packaging for FLASH and DRAM products to align with market trends for high-speed data access and large-capacity storage [3]. Group 2: Industry Position and Market Dynamics - Tongfu Microelectronics is a significant player in the global semiconductor packaging industry, ranking fourth globally and second domestically, with a strong customer base including major companies like AMD, Texas Instruments, and BYD [4]. - The company emphasizes the importance of upgrading key packaging capabilities to ensure high yield and reliability, which are crucial for the performance and delivery of downstream chips [4]. - With the semiconductor industry recovering since 2024, driven by emerging technologies such as AI and automotive electronics, the demand for packaging services is expected to grow significantly, highlighting the critical role of packaging in supporting computational power and system integration [4].