3 6 Ke·2026-01-11 04:37Group 1 - The semiconductor equipment market is experiencing significant growth driven by the demand for AI-related investments, particularly in advanced logic circuits, memory, and packaging technologies [2][3] - The global semiconductor equipment sales are projected to reach a record $133 billion in 2025, with a year-on-year growth of 13.7%, and expected to continue rising to $145 billion in 2026 and $156 billion in 2027 [2] - The wafer fabrication equipment (WFE) sector is anticipated to achieve a sales record of $104 billion in 2024, with an 11% increase to $115.7 billion in 2025, reflecting higher-than-expected investments in DRAM and HBM [2] Group 2 - Major global memory manufacturers are expanding production and upgrading technology, which is a key driver for semiconductor equipment demand [3][4] - Samsung and SK Hynix are accelerating memory capacity expansion, with Samsung focusing on high-end products and SK Hynix preparing to complete a new factory by 2027 [4] - By 2026, South Korea is expected to reclaim the second position in global chip equipment spending, reaching approximately $29.66 billion, a 27.2% increase from 2025 [4] Group 3 - The evolution of storage chips, particularly 3D NAND and DRAM, is driving demand for etching and deposition equipment, with significant increases in the number of layers and complexity of structures [5][6] - The demand for etching equipment is expected to rise sharply as 3D NAND layers increase from 32 to 128, with etching equipment usage rising from 34.9% to 48.4% [10] - The global spending on storage-related equipment is projected to reach $136 billion between 2026 and 2028, with over 40% attributed to 3D NAND investments [11] Group 4 - The demand for deposition equipment is also surging, with the need for more steps in the deposition process as the number of 3D NAND layers increases [11] - Advanced technologies such as atomic layer deposition (ALD) are becoming more critical, with ALD equipment's share in capital expenditures rising from 18% in the 2D era to 26% in the 3D era [11] - HBM technology is increasing the demand for lithography and hybrid bonding equipment due to the need for high-density interconnections and precision [12] Group 5 - Domestic companies are making significant progress in the production of core semiconductor equipment, including etching, deposition, and hybrid bonding devices [14][15] - Companies like Zhongwei, Northern Huachuang, and Yitang Semiconductor are leading in etching equipment, while Northern Huachuang and TuoJing Technology are notable in deposition equipment [14][15] - The hybrid bonding sector is also seeing advancements, with companies like Qinghe Crystal and TuoJing Technology developing innovative bonding solutions for various applications [16][17]