通富微电拟募44亿加码封测主业 绑定AMD不到五年投入62亿研发费

Core Viewpoint - Tongfu Microelectronics plans to raise up to 4.4 billion yuan through a private placement to enhance its testing capacity in various sectors, including storage chips and automotive applications, marking its first fundraising in four years [1][5]. Fundraising Details - The company aims to use the raised funds for several projects: - 8.88 billion yuan for storage chip testing capacity, adding 849,600 units annually [3]. - Nearly 11 billion yuan for automotive and emerging applications, adding 504 million units annually [3]. - 7.43 billion yuan for wafer-level testing, adding 312,000 units and enhancing automotive product reliability [3]. - 7.24 billion yuan for high-performance computing and communication, adding 480 million units annually [3]. - Additionally, 1.23 billion yuan will be allocated for working capital and repaying bank loans [4]. Historical Fundraising - Since its IPO in 2007, Tongfu Microelectronics has raised a total of 10.757 billion yuan across six fundraising rounds, primarily focused on enhancing its core business [1][5][7]. Client Base and Revenue - The company’s major client is AMD, contributing 50.35% of its revenue, with total sales from the top five clients reaching 16.478 billion yuan, accounting for 69% of total sales in 2024 [1][8]. - Revenue figures from 2022 to the first three quarters of 2025 show consistent growth, with revenues of 21.429 billion yuan, 22.269 billion yuan, 23.882 billion yuan, and 20.12 billion yuan respectively [8]. R&D Investment - Tongfu Microelectronics has significantly invested in R&D, with expenditures of 1.062 billion yuan, 1.162 billion yuan, 1.323 billion yuan, 1.533 billion yuan, and 1.123 billion yuan from 2021 to the first three quarters of 2025, totaling 6.203 billion yuan [10]. - As of June 30, 2025, the company has filed over 1,700 patents, with nearly 70% being invention patents, and has obtained technology licenses from Fujitsu, Casio, and AMD [2][10]. Capacity Expansion - To meet growing market demand, the company is expanding its production capacity, including upgrades to its advanced packaging technology and the construction of a new substation to enhance power supply capabilities [9].