“订单真的太满！”存储封测报价急涨30%，厂商酝酿第二轮提价

Core Viewpoint - The global memory chip industry is entering a new price increase cycle, with significant price hikes observed in the downstream testing and packaging segment due to capacity utilization nearing its limits [1] Group 1: Price Increases and Demand - Major memory packaging companies have raised their prices by up to 30% in response to overwhelming orders and capacity constraints, with further price increases anticipated [1] - The surge in orders is attributed to major DRAM and NAND Flash manufacturers ramping up shipments, leading to a situation where existing capacity cannot meet demand [1][2] - The price increase trend is expected to reflect positively in financial reports starting from the first quarter [1] Group 2: Capacity Utilization and Production Challenges - The core reason for the tight testing capacity is the strategic shift of upstream chip manufacturers focusing on AI-specific HBM production, which has squeezed the supply of standard DRAM and NAND chips [2] - Major Taiwanese packaging companies are operating at near full capacity, with companies like Powertech and ASE benefiting from strong order visibility and recovery in industrial control customer orders [3] - Nanya Technology is facing significant order pressure and is actively seeking to procure testing and packaging equipment to address the high market demand [3] Group 3: Market Trends and Investment Insights - AI remains the primary investment theme in the technology sector, with a focus on the supply chain for Google TPU and high-end testing segments [4] - As chip complexity increases, testing costs are expected to rise, providing valuation re-evaluation opportunities for testing suppliers like WinWay and MPI [4] - Despite short-term volatility in the CoWoS equipment sector, advanced packaging is projected to maintain strong structural demand in the long term [4]