FHEC(SH:688362) 智通财经网·2026-01-12 13:19Core Viewpoint - The company, Yongxi Electronics, plans to invest up to 2.1 billion RMB in a new integrated circuit packaging and testing production base in Malaysia, which represents approximately 13.68% of its total assets as of September 30, 2025 [1] Group 1: Investment Details - The total investment for the project will not exceed 2.1 billion RMB, subject to approval from Chinese and local authorities [1] - The project will focus on system-level packaging products, with downstream applications including AIoT and power modules [1] Group 2: Strategic Importance - This investment aligns with national industrial policy and the company's overall strategic layout, marking a significant step in capturing industry development opportunities and establishing an overseas presence [1] - Upon completion, the project is expected to address future capacity shortages, strengthen the company's market share in global integrated circuit packaging and testing, and enhance strategic cooperation with overseas major clients [1] - The initiative aims to improve profitability, reduce operational risks, and increase overall competitiveness [1]