FHEC(SH:688362) Shang Hai Zheng Quan Bao·2026-01-12 18:09Core Viewpoint - The company plans to invest in a new integrated circuit packaging and testing production base project in Malaysia, with a total investment not exceeding 210 million RMB, which represents approximately 13.68% of the company's total assets as of September 30, 2025 [2][5]. Investment Overview - The investment is aimed at enhancing the company's overseas strategic layout and promoting the development of its overseas business [5]. - The project has been approved by the company's board of directors and does not require shareholder approval [7][8]. - The investment will be executed through cash contributions from the company's own funds and self-raised funds, without involving raised capital [12][13]. Project Details - The project is currently in the preparatory stage and has not yet completed the necessary approval procedures, leading to uncertainty regarding the approval results [10]. - The project is expected to leverage Malaysia's significant position in the global semiconductor manufacturing sector, particularly in packaging and testing, to expand the company's overseas market scale and enhance revenue levels [11]. Impact on the Company - The investment aligns with national industrial policy and the company's overall strategic layout, representing a significant strategic move to seize industry development opportunities and achieve overseas industrial deployment [13]. - Upon completion, the project is anticipated to effectively address future capacity shortages, strengthen the company's market share in the global integrated circuit packaging and testing sector, and enhance strategic cooperation with overseas major clients [13].