Xuan Gu Bao·2026-01-12 23:21Industry Insights - The current supply tightness in the memory industry is driven by a surge in AI data center demand and increasing complexity in memory manufacturing, rather than a deliberate adjustment of customer structures by manufacturers [1] - Substantial improvement in memory supply is expected to take a long time, with the tight situation likely to persist until around 2028 [1] - Major packaging and testing companies in Taiwan, such as Liancheng, Huadong, and Nanmao, are experiencing overwhelming orders, leading to a first round of price increases approaching 30%, which will reflect in financial reports starting from Q1 [1] - Memory chips account for approximately 30% of the integrated circuit market, with mainland China being the second-largest storage sales market globally, following the United States [1] - Domestic storage companies like Changxin Storage and Yangtze Memory Technologies are rapidly catching up in technology and are expected to enhance competitiveness through continuous R&D and process improvements [1] Company Developments - Huicheng Co., Ltd. is strategically investing in Xinfeng Technology and establishing a partnership with Huadong Technology to expand its DRAM packaging and testing business, focusing on advanced packaging for 3D DRAM [2] - Tongfu Microelectronics is collaborating with domestic storage manufacturers for strategic synergy in storage packaging and testing [3]