京东方取得基板转移装置专利可防止局部过热影响流平效果

Group 1 - BOE Technology Group Co., Ltd. has obtained a patent titled "Support Transfer Device, Substrate Transfer Method, and Curing System," with authorization announcement number CN115973773B, and the application date is December 2022 [1] - BOE Technology Group, established in 1993 and located in Beijing, primarily engages in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 37,413.88 million RMB [1] - The company has invested in 74 enterprises, participated in 300 bidding projects, and holds 775 trademark records and 5,000 patent records, along with 47 administrative licenses [1] Group 2 - Chengdu BOE Optoelectronics Technology Co., Ltd., established in 2007 and located in Chengdu, focuses on the manufacturing of instruments and meters, with a registered capital of 2,500 million RMB [1] - Chengdu BOE has participated in 916 bidding projects, holds 5,000 patent records, and possesses 521 administrative licenses [1]