全球最大的液冷展会来了|2026深圳国际液冷产业展会及论坛

Group 1 - The 2026 Shanghai International Liquid Cooling Industry Exhibition will take place from December 9-11, 2026, at the Shanghai New International Expo Center [3] - The 2026 China (Shenzhen) International Liquid Cooling Industry Technology Exhibition is scheduled for June 10-12, 2026, at the Shenzhen International Convention and Exhibition Center [3] - The 2026 Suzhou Exhibition will occur from September 16-18, 2026, at the Suzhou International Expo Center [5] Group 2 - The rapid growth of big data has increased the demands on data center servers, necessitating higher power density in server cabinets [14] - Liquid cooling technology is becoming essential for data center efficiency, especially with the rise of 5G, edge computing, and AI applications [14][18] - The exhibitions aim to showcase the latest products and technologies in the liquid cooling industry, attracting professional audiences from data centers, power, electronics, edge computing, AI, and renewable energy sectors [14] Group 3 - The 2026 IDC exhibition is expected to cover an area of 15,000 square meters and will feature participation from major organizations such as the National Supercomputing Center in Shenzhen and Tencent [18] - Various technical exchange activities will be held during the IDC 2026 exhibition, focusing on industry hot topics and promoting diversified marketing strategies [19] - The exhibition will include a wide range of products covering cooling liquids, refrigerants, and various cooling devices, showcasing over a thousand new products across the entire industry chain [56] Group 4 - Shenzhen Angpai Technology Co., Ltd. is currently in the A-share IPO guidance stage, with plans to expand production capacity and R&D investment to capture market growth in liquid cooling [66] - The company has a registered capital of 90 million RMB and aims to leverage its professional R&D team and partnerships with universities to enhance its technological capabilities [66][68] - Angpai Technology's product offerings include liquid cooling module design, thermal management system integration, and innovative compressor technologies, with a focus on high reliability and efficiency [71][72]