21亿元,甬矽电子拟在马来西亚建封测基地

Core Viewpoint - Company plans to invest in a new integrated circuit packaging and testing production base in Malaysia, with a total investment not exceeding 2.1 billion RMB, accounting for approximately 13.68% of the company's total assets [1][5]. Investment Project Details - Investment Type: New Project [2] - Project Name: Integrated Circuit Packaging and Testing Production Base in Malaysia [2] - Main Content: Production lines and supporting facilities for integrated circuit packaging and testing [2] - Location: Penang, Malaysia [2] - Total Investment Amount: Not exceeding 210,000 million RMB [2] - Company Investment Amount: Not exceeding 210,000 million RMB [2] - Construction Period: 60 months [2] - Within Main Business Scope: Yes [2] Strategic Importance - Malaysia holds a significant position in global semiconductor manufacturing, particularly in packaging and testing, with Penang being a key hub attracting major international chip manufacturers [3][7]. - The project aims to leverage the local market environment and industrial foundation to expand the company's overseas market scale and enhance revenue levels, thereby consolidating and improving the company's industry position [3][7]. Financial Performance Forecast - Company expects to achieve operating revenue of 4.2 billion to 4.6 billion RMB in 2025, representing a year-on-year increase of 16.37% to 27.45% [8]. - Projected net profit for 2025 is estimated to be between 75 million and 100 million RMB, with a year-on-year growth of 13.08% to 50.77% [8]. - Expected net profit after deducting non-recurring items for 2025 is projected to be between -50 million and -30 million RMB [8]. Market Dynamics - The global semiconductor industry continues to grow, driven by demand in artificial intelligence, high-performance computing, and data center infrastructure [10]. - The company benefits from the sustained growth of overseas major clients and the development of domestic core SoC customer groups, maintaining revenue growth [10]. - An increase in the proportion of advanced packaging products and optimization of product structure, along with scale effects, have contributed to a decrease in unit manufacturing costs and period expense ratios, driving net profit growth [10].