帝尔激光：公司已完成面板级玻璃基板通孔设备出货 实现晶圆级和面板级TGV封装激光技术全面覆盖

Core Viewpoint - The company, Dier Laser (300776), has developed TGV laser micro-hole equipment that enables precise processing of glass substrates, facilitating subsequent metallization processes for applications in semiconductor and display chip packaging [1] Group 1: Technology Development - The TGV laser micro-hole equipment utilizes a precision control system and laser modification technology to process various materials [1] - The company has completed the shipment of panel-level glass substrate through-hole equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] Group 2: Industry Applications - The technology is applicable in fields such as semiconductor chip packaging and display chip packaging, indicating a broad market potential [1]