景旺电子：公司已量产可应用于AI计算基础设施等领域的高端PCB

Core Viewpoint - The company has established itself as a key supplier of high-end PCB products for leading global AI computing infrastructure firms, showcasing its technological maturity and product reliability in the AI sector [2]. Group 1: Production Capabilities - The company has achieved mass production capabilities for advanced PCB products, including 40-layer HLC, 6-layer 22-layer HDI, and 14-layer HDI using mSAP technology [2]. - The company possesses manufacturing capabilities for 70-layer HLC, 9-layer 28-layer HDI, 12-layer anylayer rigid-flex boards, and high-speed FPC [2]. - The 9-layer HDI received customer certification within 90 days, indicating rapid acceptance and reliability in the market [2]. Group 2: Future Developments - The company is accelerating the research and development of 11-layer HDI technology, aiming to upgrade product specifications such as line width, blind hole diameter, and other metrics to industry-leading standards [2]. - The company is strategically positioning itself for the next generation of AI computing products through these advancements [2].