Core Insights - Black Sesame Intelligence showcased its latest achievements in assisted driving, embodied intelligence, and consumer electronics at CES 2026, marking its strategic shift from "driving assisted driving" to "promoting intelligent evolution" [2] Group 1: Assisted Driving Solutions - The company has developed a complete product matrix in the assisted driving sector, featuring the Huashan series chips for assisted driving and the Wudang series for cross-domain computing [3] - The Huashan A2000 chip, which debuted at CES 2026, has received widespread recognition for its performance and has been successfully integrated into mass-produced vehicles in collaboration with major automakers [3] - The Wudang C1296 chip made its overseas debut, enabling a comprehensive solution for digital dashboards, smart cockpits, and assisted driving, showcasing high integration with partners like Dongfeng and Continental [4] Group 2: Embodied Intelligence - Black Sesame Intelligence introduced the SesameX multi-dimensional embodied intelligence computing platform, aimed at providing an open and scalable foundation for robotic applications, marking its first overseas appearance [5] - The platform includes various series to meet different robotic needs, promoting the industrial application of embodied intelligence [5] Group 3: AI Imaging Solutions - The company's AI imaging solutions have been widely adopted in consumer electronics, with over 500 million devices equipped globally [6] - A strategic acquisition of Yizhi Electronics enhances its capabilities in low-power, cost-effective AI SoC chips, with related products showcased at CES [6] - The AI imaging solutions are integrated into various consumer electronics, providing enhanced user experiences through advanced algorithms [7]
黑芝麻智能携创新成果赴科技之约