嘉元科技：公司在PCB铜箔领域的发展战略主要围绕高端化、差异化展开

Core Viewpoint - The company is focusing on high-end and differentiated products in the PCB copper foil sector to meet the demands of emerging fields such as AI, computing power, and 5G [2] Group 1: Company Strategy - The company's development strategy in the PCB copper foil field emphasizes high-end and differentiated products, including high-frequency and high-speed copper foil, HDI copper foil, HVLP, DTH, and special functional copper foils [2] - The company is implementing a "produce one, reserve one, research one" strategy to accelerate the R&D and manufacturing of various high-performance electrolytic copper foil products [2] Group 2: Product Development and Achievements - The company has made technological breakthroughs in high-performance electronic circuit copper foils, including RTF, HTE, HVLP, DTH, and HDI copper foils [2] - The ultra-thin copper foil (UTF) for PCBs has entered mass production, and significant progress has been made in developing RTF/HVLP products for high-frequency and high-speed circuit and IC packaging applications [2] - RTF has passed certification testing by leading enterprises and is capable of mass production, while other products have completed laboratory validation and are undergoing testing with downstream customers [2]