芯源微：未来公司将持续提高清洗设备产能

Core Viewpoint - The company, ChipSource Micro, has developed advanced cleaning equipment with significant advantages in the semiconductor manufacturing process, focusing on enhancing cleaning efficiency and reducing damage to wafers [1] Group 1: Equipment Features - The front-end chemical cleaning equipment features a newly developed high-efficiency, low-damage jet nozzle, offering high process coverage, stability, cleanliness, and capacity [1] - The front-end physical cleaning equipment is equipped with low-damage atomization cleaning nozzles and brushes, suitable for domestic front-end wafer manufacturing [1] Group 2: Application Areas - The back-end single-wafer wet processing equipment includes cleaning machines, glue removal machines, and etching machines, applicable for incoming material cleaning, TSV deep hole cleaning, flux cleaning, and various wet etching processes [1] Group 3: Future Development - The company plans to continuously increase the production capacity of cleaning equipment, research key technologies in chemical cleaning, and further optimize unit and overall machine design [1]